Specifications
Ion Beam Milling Systems Leica EM TIC3X and Leica EM TXP
Specifications
Ion Beam Milling Systems Leica EM TIC3X and Leica EM TXP
- Preparation of samples up to 25 mm diameter.
- Fully computer-controlled milling parameters.
- The Ion Beam Milling technique, known as Ion Beam Etching, is used to achieve a well-prepared sample surface quality for high resolution imaging and analysis. It removes residual artefacts from mechanical cutting and polishing. The ion polished cross-sections and planar samples prepared by Ion Beam Etching can be used for electron microscopy imaging as well as microstructural analysis applications such as EDS, WDS, Auger and EBSD.